Thick-film integrated circuit

Japanese: 厚膜集積回路 - あつまくしゅうせきかいろ（英語表記）thick-film integrated circuit

An integrated circuit is constructed by forming film resistors, capacitors, coils, etc. on an insulator (usually glass or porcelain) as a substrate, bonding the electrode terminals of semiconductor elements, and connecting these elements with a metal film. It is called a thick film because the film is printed or applied to the substrate as an ink or paste and then baked, resulting in a film thickness of several μm to 50 μm. Compared to monolithic integrated circuits, there is a high degree of freedom in material selection and design, so the range of applications is wide, and it is used for analog circuits, high resistance, high precision circuits, and relatively high power applications, but there is a limit to how much integration can be increased, making it difficult to reduce the unit price. It is often used as a hybrid integrated circuit combined with a semiconductor integrated circuit.

Source: Encyclopaedia Britannica Concise Encyclopedia About Encyclopaedia Britannica Concise Encyclopedia Information

Japanese:

基板として絶縁体 (通常はガラスや磁器) を用い，この上に膜状の抵抗器，コンデンサ，コイルなどを形成し，半導体素子は電極端子を接着し，これらの素子の間を金属膜で接続して構成した集積回路。厚膜と称するのは，膜をインキまたはペースト状のものとして基板に印刷もしくは塗布したのち，焼成するため，膜厚が数μm～50μm程度になることによる。モノリシック集積回路に比べて，材料の選択と設計の自由度が高いため応用範囲が広く，アナログ回路，高抵抗，高精度の回路や比較的電力の大きい用途に供されるが，集積度を上げるには限度があり，単価を下げにくい。半導体集積回路と組合せた混成集積回路として用いることが多い。

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